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The ongoing environmental discussion has also touched the field of adhesives. In response to the concerns expressed, solvent-free systems are gaining increasing significance in the pressure-sensitive adhesives segment. This trend has also strongly affected radiation-curing hot-melt adhesives, evident from the large amount of literature published on this subject recently. The versatility of radiation-curing adhesives is described in detail in a paper by Huber [1].
Our paper discusses investigations of various parameters such as:
• raw material selection (base elastomers, resins)
• the difference between UV and electron beam radiation
• the influence of the residual oxygen content during radiation curing on the different adhesive properties.
These investigations form part of an exhaustive research programme designed to assess the potential and limitations of radiation-curing hot-melt adhesives based on block copolymers. Intermediate results of the investigations have already been published [2, 3].
