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For more than four decades radiation curing of pressure sensitive adhesives has been known. Work has
been contributed by many companies and institutes and thus the information is scattered over a great
number of patents, articles in scientific and trade journals, conference papers, and reviews.
Up to 1974 there is a status report prepared by R. Dowbenko and . The patent literature until
1975 is compiled by Stueben2.
Recent work is reviewed in a chapter by 3 with acrylic monomer systems as the main point. Further
there are two detailed conference papers: The chemical background is treated by 4 and the
employed polymeric materials are described by R.W. . Hoffman et at. have shown some commercial
applications on specialized fields.6
The intention of this paper is to have a look at the development of radiation curing of pressure sensitive
adhesives from a user's point of view. We cannot give a complete compilation of all relevant patents and
articles here but will discuss the most important steps.
